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Foundry Services

Epitaxy film disposition , Fab, Post-processing and analysis services available (4 inch) :Some 6-8 inch processes available
Epitaxy film disposition	Wafer cleaning	Wafer chemical treatment	Photolithography	Deposition process	Heat treatment	Etching	Post-processing	Measurement	Analysis
GaN-on-Sapphire	Organic cleaning	Acid process (Acidification)	PR coating	SiO₂(PECVD)	RTA	GaN	Grinding	Probe	PL
GaN-on-Si	Acid cleaning	Base process	Exposure	ITO(RPO)		SiO₂	Lapping	Sort	XRD
GaN-on-SiC		Organic treatment	Development	Metal(E-beam)			Poliching		SEM
									AFM
									a-step

MOCVD equipment user guide
ID	Model	Capacity	Application
MOCVD#1	Veeco	14x4 inch, 5x6 inch, 3x8 inch	GaN Based LED, Power device
MOCVD#2	Veeco	14x4 inch, 5x6 inch, 3x8 inch	GaN Based LED, Power device
MOCVD#3	Aixtron	5x4 inch	GaN/AIN Based LED, Power device (Max Temp. 1400℃)
MOCVD#4	Aixtron	5x8 inch	GaN Based LED, Power device
PL		4 inch, 6 inch, 8 inch
XRD		4 inch, 6 inch, 8 inch
AFM		4 inch

Fab Areas
Machine	Wafer Size	Note
Wet Station (Acids)	4 inch	H₂SO₄, H₂O₂, HNO₃, HCl, BOE
Auto Wet Station (Organics)	4 inch	Acetone, IPA, PR stripper
Spin Dryer#1,2,3	4 inch
Track#1,2	4 inch	PR Coating (Positive, Negative)
Track#3	4 inch	PR Develop
Stepper	4 inch	Expose
Aligner	4 inch	Expose
PECVD#1,2	4 inch	SiO₂ Deposition
O₂ Asher	4 inch
ICP-RIE #1,2,3	2 inch, 4 inch, 6 inch, 8 inch	GaN, SiO₂ Dry Etch
RPD	2 inch, 4 inch, 6 inch, 8 inch	ITO Deposition
E-beam#1,2,3	2 inch, 4 inch, 6 inch, 8 inch	Cr, Ni, Ti, Al, Au, AuSn, SAC Deposition
RTA#1,2,3	4 inch	300~700℃ Anneal
Grinder Machine	4 inch
Lapping Machine	4 inch
Polishing Machine	4 inch
Wafer Breaker#1,2	4 inch
Laser scriber#1,2	4 inch
Wafer Prober#1,2	4 inch
Chip Prober#1,2	4 inch
Chip Soter#1,2	4 inch
SEM	-
Alpha Step	2 inch, 4 inch, 6 inch, 8 inch
Filmetrics	2 inch, 4 inch, 6 inch, 8 inch

For product inquiries and technical support,
please contact us via online inquiry form.

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